In PCB (printed circuit board) layout, the proper layout of components is a key step to improve manufacturability. Here are some layout strategies and recommendations for optimizing component layout to improve the manufacturability of PCBS:
First, follow the principle of manufacturability design
Consider PCB manufacturing process:
In the layout, the PCB manufacturer’s process capabilities and limitations should be understood and considered, such as minimum line width, minimum spacing, drilling size, etc.
Avoid designing boards that cannot be manufactured and ensure that the layout meets the manufacturer’s process requirements.
Easy to automate production:
The layout should facilitate the automation of production processes such as SMT, plug-in and welding.
Reserve enough operating space for the robot arm to avoid too small component spacing or too crowded layout, resulting in sticker head collision or inaccurate installation.
2. Optimize component layout
Partition by function:
The components of related functions are placed in a centralized location for easy wiring and debugging.
For example, the power module is surrounded by a filter capacitor, inductance, etc., to form a stable power supply unit; The signal processing chip is adjacent to the corresponding amplifying and filtering circuits to shorten the signal transmission path.
Unified component orientation:
Orientation of similar components in the same direction facilitates efficient and error-free welding.
The direction of the polar device should not be more than 2, and it is best to unify the direction to reduce assembly errors.
Avoid layout conflicts:
Avoid placing large components after small components to prevent small components from mounting problems due to welding effects of large components.
Adequate plug-in space and welding space should be left around the plug-in element, and the diameter of the plug-in hole should be slightly larger than the diameter of the component pin.
Pay attention to heat dissipation problems:
The high-heat elements should be placed in a well-ventilated position and kept at a certain distance from other components to facilitate heat dissipation.
For components that require heat dissipation, heat dissipation measures such as heat sinks or heat pipes can be considered.
Consider testing and maintenance:
In the layout, adequate space should be reserved for testing and maintenance.
Test points are set on key signal nodes and power nodes to facilitate measurement with test instruments.
Three, specific layout skills
Edge component layout:
Prioritize the placement of edge components such as connectors, switches, jacks, etc., which usually cannot be moved due to mechanical housings.
Avoid placing sensitive high-speed devices close to the edge of the board to reduce the impact of electromagnetic interference (EMI).
High frequency component layout:
High-frequency components should be as close as possible to shorten the length of the high-frequency signal line and reduce signal interference.
For high-frequency components that need shielding, measures such as shielding covers or ground copper sheets can be considered.
Power and grounding layout:
Placing the power and ground plane layers inside the board and keeping them symmetrical and centered helps prevent the board from deforming.
When supplying power to the IC, use the public channel for each power supply to ensure that the cable is stable and the width is moderate.
Avoid overlapping and crossing layouts:
Overlap and cross-wiring between components should be avoided to prevent short circuits and signal interference.
For unavoidable cross-wiring, a vertical crossover should be adopted and the line spacing should be increased to reduce interference.
Consider the warping and deformation of the PCB:
Uneven PCB can lead to inaccurate positioning, affecting component insertion and automatic plug-in installation.
Therefore, in the layout should try to avoid placing too many heavy components on one side of the PCB to reduce the warping and deformation of the PCB.
Set up auxiliary edges and positioning holes:
3-5 mm top clamping edges are required on the upper and lower sides of the PCB to facilitate the transmission and positioning of automation equipment.
The installation positioning hole is usually pre-designed on the board, the positioning hole should be in a non-porous state (not metallized, not conductive), and the aperture and position are determined according to the external environment of the PCB installation.
Fourth, check and optimize the layout
Using the Design Rule Checking (DRC) tool:
After the layout is complete, the PCB layout is thoroughly checked using the DRC tool to ensure that the layout complies with the design rules and standards.
According to the results of the DRC tool, the layout is optimized and adjusted.
Perform signal integrity analysis:
Analyze the signal integrity of high-speed signal lines to ensure the integrity and accuracy of signal transmission.
According to the analysis results, the length of signal line, impedance matching and other parameters are adjusted to reduce signal reflection and interference.
Communication and collaboration with manufacturers:
After the layout is completed, communicate and collaborate with the PCB manufacturer to ensure that the layout meets the manufacturer’s process requirements.
Based on feedback and suggestions from manufacturers, the layout is optimized to improve manufacturability.
By following the above layout strategies and recommendations, the manufacturability of PCBS can be significantly improved, problems and costs in the production process can be reduced, and product quality and production efficiency can be improved.
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